International Applied Reliability Symposium
 

2009

Europe 2009
Program Matrix
Venue and Hotel
Register
Info for Presenters

Archive

Past Symposia
Photo Albums
Order Proceedings

Contact

+(48) 22 322 76 31 (Polish/English)
+(48) 22 322 70 19 (German)

+(48) 22 322 70 20 (Spanish)
InfoEurope@ARSymposium.org
Send Link... E-mail Link to a Friend

Worldwide

North America
South America
Asia Pacific
Europe
India

Track 1 Session 8
2:20 to 3:20 p.m. Thursday March 26, 2009

RoHS and Lead Free Electronics: Component Issues

The European Union’s RoHS Directive and lead-free soldering process have had a serious impact on the worldwide electronics industry, on electronic components and on the reliability of lead-free electronic devices and systems. This presentation describes the new requirements, terminology and the main problematic aspects of RoHS (particularly lead-free) conversion. Explanation of new standards and possible reliability problems may help designers in the right choice of components for RoHS compliance and lead-free soldering process. It should help to implement the correct conversion process and to avoid the wrong and misleading interpretations by R&D, Engineering, Purchasing, QA/QC, Incoming Inspection and other personnel of Original Equipment Manufacturers (OEMs) and Electronics Contract Manufacturers (ECMs).

Key Words: RoHS and Lead Free components, Most Significant Impact of RoHS, New Terminology, Mixed Technology, Long-term Reliability Problems, New Standards

Lev Shapiro
Component Master Ltd
Israel

The ARSymposium Web site is sponsored and maintained by ReliaSoft Corporation.
Copyright ©2003-2008 ARS, All Rights Reserved. Contact
Webmaster.

PRIVACY POLICY
Questions +1.520.886.0410